Number of Layers:                                        2 to 12
  
Minimum Line Width & Spacing:                  5/5 Mils
  
Finished Board Thickness:                             12 to 93 Mils
  
Finished Hole Size:                                        12 Mils
  
Minimum SMD Pitch:                                    16 Mils
  
Layer to Layer Registration:                         +/- 5 Mils
  
Solder Mask Printing Registration:               +/- 3 Mils
  
Hole Size Tolerance:                                      +/- 2 Mils
  
Aspec Ration:                                                 6:1
  
Maximum Board Size:                                    20"  x  24"
  
Hot Air Solder Leveling
  
Chemical Nickel Gold
  
Anti-Tarnish Coating    ( Entek Process )
  
Gold Emersion
  
Blind and Buried Vias
  
Material:    FR4,    FR2,    CEM1,    CEM3